全球光學與光電產業的領先巨頭蔡司帶領品質議題首次登上 COMPUTEX 官方論壇，聚焦 AI 硬體品質關鍵。品質正從製造端的支援角色，轉變為直接影響效能、良率與交付能力的關鍵要素。蔡司推出「Chip-to-Rack」端到端品質解決方案，涵蓋晶片、PCB、散熱、連接與機櫃系統整合等關鍵環節。相關技術包含非破壞性 3D X-ray、電子顯微鏡，結構光與CMM，支援從失效分析（FA）到 inline／at-line 與自動化應用，並涵蓋晶片、HBM、PCB、液冷及 CPO ，全面提升 AI 硬體的良率與可靠性，實現全價值鏈的品質覆蓋。

As a global leader in optics and optoelectronics, ZEISS brings the quality discussion to the official COMPUTEX 2026 Forum stage for the first time, highlighting the critical role of quality in AI hardware. Quality is evolving from a manufacturing support function into a direct driver of performance, yield and delivery readiness.

ZEISS offers a Chip-to-Rack end-to-end quality portfolio covering chips, PCB, thermal management, connectivity and rack-level system integration.

Technologies include non-destructive 3D X-ray, electron microscopy, structured light scanning and coordinate measuring machines (CMM), supporting applications from failure analysis to inline, at-line and automated production.

ZEISS solutions span chips, HBM, PCB, liquid cooling and CPO, helping improve yield and reliability while delivering quality coverage across the full AI hardware value chain.